20Khz ultrasonic dip tinning welding Ultrasonic Soldering iron Pots

We offer a variety of methods to acoustically activate molten metal. Another popular method is to immerse a Power Probe's Wear-Tip directly into the molten material. The ultrasonic energy will remove dissolved gases and enhance grain structure refinement. The Permendur Power Probe offers the ability to acoustically activate molten metal in continuous or batch casting operations.
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20Khz ultrasonic dip tinning welding Ultrasonic Solder Pots

  Parameter
Model No. RPS-DS20
Ultrasonic Frequency 20Khz
Maximum Output 1000 Watt
Temperature Range 150 ~ 400 °C
Power Supply 220V / 50-60 Hz
Ultrasonic Generator Size 250(W) x 310(L) x 135(H) mm
Weight 5 Kg
Feature Ultrasonic Amplitude Adjustable
Pot dimension 20*15cm
Avail Soldering Matrial ITO Glass, AL, Mo, Cu etc.,
  Description We offer a variety of methods to acoustically activate molten metal. Another popular method is to immerse a Power Probe's Wear-Tip directly into the molten material. The ultrasonic energy will remove dissolved gases and enhance grain structure refinement. The Permendur Power Probe offers the ability to acoustically activate molten metal in continuous or batch casting operations. Ultrasonic soldering is used to join materials with either a metallurgical or mechanical bond. A metallurgical bond is formed when the oxide from the base metal is removed through ultrasonic cavitation and implosion in the solder. The solder then comes in to contact with the base metal and the ionic attraction between the two forms a bond. A tin or lead solder bonded to copper is an example of this. A mechanical bond usually involves no oxide on the base material. The cavitation and implosion in the solder create forces that agitate the materials and form an interlocking mechanical bond. Coating a ceramic with solder is an example of this process.   When to use Ultrasonic Soldering There are two main reasons for using Ultrasonic Soldering: 1. To eliminate the need for flux in the soldering process 2. To apply solder to ceramics and similar materials The advantages of removing flux from the process are that there is no need for post-process cleaning and wicking caused by surface tension from the flux is removed. Eliminating post-process cleaning has the obvious benefit of cost saving for both the process and the flux itself. The benefit of eliminating wicking is that the solder coating on the base material can be better controlled.   Application
  • Aluminum components
  • Ferrite components
  • Glass components
  • Silicon wafers
  • Ceramic components
  • Semiconductor chips
  • Metals etc.
CharacteristicsFluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning System 0
  • Easy soldering upon un-bondable material (metal, glass, ceramics) by simple dipping process.
  • No need for flux
  • Reliable bonding/sealing
  • Best used in difficult, small-surface places with limited access
  • Ceramic components
  • Semiconductor chips
  • Metals etc.

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